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October 2005 IC News Alphabetical: By Company (A - L) | By Company (M-Zo) |
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October 2005: IC News By Business Category | IC Product News By Category | |
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Timelined News: Latest IC News | Archived IC News |
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October 2005: | IC Research News | IC Financial / Earnings News| |
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Business Category |
Company |
Semiconductor News By Business Category, October 2005: Acquisitions, Agreements, Conferences, Contracts (Customers, Design Wins), Funding, IPOs, Licenses, Patents |
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Acquisition |
Freescale Semiconductor |
Freescale acquires CommASIC |
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Acquisition |
Knowles Electronics |
Dover Corp. acquires Knowles Electronics for $750 million |
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Acquisition |
Matrix Semiconductor |
SanDisk Corporation acquires Matrix for $250 million |
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Acquisition |
MOSAID Technologies |
MOSAID completes acquisition of Virtual Silicon |
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Acquisition |
SanDisk |
SanDisk acquires Matrix for $250 million |
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Acquisition |
Virtual Silicon Technology |
MOSAID completes acquisition of Virtual Silicon |
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Agreement |
EZchip Technologies |
EZchip Technologies and TeraChip announce interoperable switching architecture |
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Agreement |
Freescale Semiconductor |
Freescale and Jungo to deliver residential and business gateway platforms |
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Agreement |
Octasic |
Teledata Networks and Octasic to cooperate on next generation VoIP |
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Agreement |
Soitec Group |
The Soitec Group and the SEX Group enter into strained silicon joint development agreement |
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Agreement |
Teledata Networks |
Teledata Networks and Octasic to cooperate on next generation VoIP |
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Conference |
AeA Classic |
Halla to speak at AeA |
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Conference |
Entegris |
Entegris Conference Attendance |
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Conference |
GSPx |
AccellChip presents paper on fixed point |
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Conference |
IC Packaging Technology Expo |
IC Packaging Technology Expo |
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Conference |
ISSYS |
ISSYS to present at Fuel Cell Conference |
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Conference |
Lehman Brothers Global Technology Conference |
Cirrus Logic announces conference schedule |
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Conference |
SatCon Technology |
SatCon Technology presents paper at Energy Storage Conference |
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Conference |
Tessera Technologies |
Tessera announces its second annual Technology Symposium in Japan |
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Contract |
Advanced MicroSensors |
AMS supplying Tandberg with magneto-resistive tape heads |
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Contract |
Agilent Technologies |
King Yuan Electronics selects Agilent’s 93000 Pin Scale system to test complex SOCs |
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Contract |
AMI Semiconductor |
AMI Semiconductor wins $6.6 million contract |
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Contract |
Analog Devices |
Holley Communications selects Analog’s SoftFone LCR chipset for 3G TD-SCDMA cellular headset solution |
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Contract |
Analog Devices |
ZTE Corporation designs in Analog Devices' SoftFone-LCR chipset and Datang Mobile's solution into 3G Cellular TD-SCDMA |
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Contract |
Analog Devices |
Analog Devices to supply 3G cellular chipsets to China’s Holley |
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Contract |
ARM |
VeriSilicon licenses ARM’s microprocessor IP cores |
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Contract |
Artesyn Communication |
Artesyn Communication Products introduces ProcessorPMC protocol engine |
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Contract |
Atmel |
FingerGear introduces Bio Computer-On-a-Stick (BCOC) |
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Contract |
Axcelis Technologies |
UMC places follow on order with Axcelis for RadiantStrip 320Lk system |
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Contract |
Cabot Microelectronics |
Samsung Electronics selects Cabot Microelectronics as Best |
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Contract |
Chipcon AS |
Cirronet integrates Chipcon’s chip into its ZigBee products |
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Contract |
Cree Inc. |
Permlight ships cabinet lighting fixtures equipped with Cree’ durable LEDs |
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Contract |
ESI |
Hynix Semiconductor orders ESI’s Model 9830 |
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Contract |
ESI |
ProMOS Technologies orders ESI's Model 9830 |
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Contract |
Evigia Systems |
NASA selects Evigia Systems for MOS MEMS accelerometer development contract |
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Contract |
Fairchild |
Toshiba Carrier Corporation selects Fairchild Semiconductor’s power module |
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Contract |
Fairchild |
Toshiba Carrier Corporation selects Fairchild Semiconductor’s power module |
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Contract |
Fidus Systems |
Fidus Systems reports $1.4 million in signed contracts |
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Contract |
Freescale Semiconductor |
NESA utilizes Freescale's ZigBee compliant platform |
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Contract |
Global IP Sound |
Global IP Sound reports more chip and handset licensees |
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Contract |
Hynix Semiconductor |
Hynix orders ESI’s Model 9830 |
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Contract |
Integral Vision |
Integral Vision receives another order for SharpEye inspection |
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Contract |
Integrated Device Technology |
Ample Communications selects IDT’s network search engine for Internet Appliance solution |
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Contract |
Integrated Device Technology |
Bay Microsystems selects IDT's as preferred partner, Network Search Engines chip |
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Contract |
IPextreme |
IPextreme to offer Freescale’s FlexRay communication controller IP core |
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Contract |
ISSYS |
ISSYS to supply MEMS components for KEM’s Micro Density Meter products |
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Contract |
King Yuan Electronics |
King Yuan Electronics selects Agilent’s 93000 Pin Scale system to test complex SOCs |
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Contract |
Koncern Nauchny Center, KNC |
Infineon transfers chip assembly technology to Russian company |
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Contract |
Luna Innovations |
NASA awards contract for MEMS sensor development to Luna |
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Contract |
Marvell Semiconductor |
WavePlus Technology, Marvell and one other unnamed semiconductor company have licensed Global IP Sound (GIPS) technology for VoIP chip applications. Unnamed handset manufacturer also licensed. |
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Contract |
ProMOS Technologies |
ProMOS Technologies orders ESI's Model 9830 |
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Contract |
Quantum Logic Devices |
NASA awards contract to Quantum Logic Devices |
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Contract |
Rackable Systems |
Rackable Systems introduces servers based on Intel dual core Xeon |
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Contract |
Samsung Electronics |
Samsung Electronics selects Cabot Microelectronics as Best |
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Contract |
SigmaTel |
Disney Mix Stick Player based on SigmaTel’s audio SOC |
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Contract |
SMC Networks |
SMC ships Gigabit Ethernet Switch includes Agere Systems Ethernet chips |
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Contract |
SMSC |
Mercedes Benz selects SMSC’s network technology |
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Contract |
sp3 Diamond |
sp3 Diamond awarded contract to incorporate nanoparticle diamond thin film deposition |
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Contract |
Teradyne |
Atheros Communications selects Teradyne's FLEX test system |
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Contract |
Texas Instruments |
TCL Communication Technology selects Texas Instruments 2.5 G chip platform |
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Contract |
Texas Instruments |
Samsung selects Texas Instruments TI OMAP platform and Bluetooth solutions for Series 60 smartphones |
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Contract |
TPL Inc |
NASA awards contract to TPL, Inc., for |
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Contract |
TTPCom |
TTPCom enters into agreement with Texas Instruments to make AJAR applications platform available |
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Contract |
Ultra Clean Holdings |
Ultra Clean reports two contracts valued at up to $25 million |
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Contract |
UMC |
UMC places follow on order with Axcelis for RadiantStrip 320Lk system |
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Contract |
Veeco Instruments |
LG Innotek and Huga place Veeco’s MOVCD system into optoelectronic production |
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Contract |
VeriSilicon |
VeriSilicon Holdings licenses ARM’s microprocessor IP cores |
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Contract |
Virginia Diodes |
NASA awards contract to Virginia Diodes |
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Contract |
WavePlus Technology |
WavePlus selects Global IP Sound’s VoiceEngine |
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Contract |
WavePlus Technology |
WavePlus Technology, Marvell and one other unnamed semiconductor company have licensed Global IP Sound (GIPS) technology |
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Contract |
Xilinx |
VMETRO introduces CAML-MOD3 CameraLink adapter module- based on Xilinx Virtex Pro |
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Contract |
Zoran |
Samsung selects Zoran’s Quatro for Dye Sublimation PhotoPrinters |
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Development |
WiQuest Communications |
WiQuest opens international customer development and support center in Taipei |
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Distribution |
eASIC |
eASIC and INNOTECH enter into distribution and technical support agreement |
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Distribution |
INNOTECH |
eASIC and INNOTECH enter into distribution and technical support agreement |
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Distribution |
Nordic Semiconductor |
Nordic Semiconductor enters into Pan-Asian distribution agreement |
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Distribution |
TAK Imaging |
TAK Imaging enters into exclusive sales agreement with FM COM |
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Employment |
Challenger Gray & Christmas Inc., |
Challenger, Gray & Christmas Inc. report high-tech still downsizing |
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Facility |
Eksigent Technologies |
Eksigent, microfluidic company, expands |
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Foundry |
ZF Micro Solutions |
ZF Micro Solutions enters into multi-year foundry agreement with IBM |
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Funding |
eASIC |
eASIC receives $17.5 million in funding |
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Funding |
eMagin |
eMagin Funding / Financing Report |
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Funding |
Ember Corp. |
Ember Corporation receives investment from In-Q-Tel |
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Funding |
ISSSY |
ISSSY completes $1.97 million NIST Advanced Technology Program |
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Funding |
ISSYS |
ISSYS receives grant from Michigan Technology Tri-Corridor Fund |
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Funding |
Ovonyx |
Ovonyx receives additional investment from Intel Capital |
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Funding |
PMC-Sierra |
PMC-Sierra prices $225 million senior convertible notes |
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Funding |
PropheSi Technologies |
PropheSi Technologies Funding / Financing Report |
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Funding |
pSivida |
pSivida Funding / Financing Report |
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Funding |
Sensicast Systems, Inc. |
Sensicast Obtains Funding of $13 Million |
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Funding |
Sensor System Solutions |
Sensor System Solutions Funding / Financing Report |
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Funding |
The Computer History Museum |
The Computer History Museum receives $15 million |
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Funding |
WiSpry |
WiSpry provides matching funds with NSF for MEMS packaging research |
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IPO |
Saifun Semiconductors |
Saifun files IPO with SEC |
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Joint Venture |
Oki Electric Industry |
Oki Electric and ACCESS Co. establish joint venture to develop voice and video products for mobile terminals |
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License |
AGEIA Technologies Inc. |
ChessBase licenses AGEIA's PhysXSDK to develop chess game |
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License |
AMI Semiconductor |
AMI Semiconductor qualifies Cavendish Kinetics’ embedded One-Time Programmable (OTP) core technology for foundry |
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License |
Cavendish Kinetics |
AMIS qualifies Cavendish core technology for foundry |
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License |
CEVA |
National integrates CEVA’s Xpert Teak DSP core into Bluetooth |
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License |
MOSAID Technologies |
MOSAID enters into five-year, non-exclusive DRAM license |
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License |
MoSys |
Azul Systems verifies MoSys' 1T SRAM in Vega multiprocessor chip |
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License |
National Semiconductor |
National Semiconductor integrates CEVA’s Xpert Teak DSP core into Bluetooth |
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License |
Silicon Genesis |
Silicon Genesis licenses NanoTech technology to Shin-Etsu for optoelectronic manufacturing applications |
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License |
TTPCom |
Amoi Mobile licenses TTPCom’s AJAR applications platform |
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License |
WavePlus Technology |
WavePlus selects Global IP Sound’s VoiceEngine |
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Market |
California Micro Devices |
CMD passes one billionth ASIP shipment |
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Market |
Eudyna |
Report indicates Eudyna is leader in GaAs market |
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Market |
Integrated Device Technology |
IDT passes 7 Million Network Search Engine Chip Shipments |
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Market |
Strategy Analytics |
Strategy Analytics reports automotive semiconductor market to reach $16.3 billion in 2005. |
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Patent |
Honeywell |
Honeywell obtains patent for nanotube sensor |
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Patent |
International Rectifier |
International Rectifier awarded $6.241 million |
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Patent |
ISSYS |
ISSYS obtains patent for micromachine lysing devices. |
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Patent |
Lockheed Martin |
Lockheed Martin obtains patent for carbon nanotube |
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Patent |
LSI Logic |
LSI Logic obtains patent for memory cell based on nanotube technology |
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Patent |
PTS Corp |
PTS Corp. awarded MEMS patent |
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Patent |
Rosemount Aerospace Inc |
Rosemount Aerospace obtains silicon micromirror patent |
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Patent |
Tanisys Technology |
Tanisys obtains patent for test equipment technology |
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