GRACE SEMICONDUCTOR MANUFACTURING CORP.
Zhangjiang Hi-Tech Park
Shanghai, China
GENERAL CONTACTS
URL: www.gsmcthw.com
FAST FACTS
Classification: Foundry
MAIN INTEGRATED CIRCUIT PRODUCTS / TECHNOLOGY
Wafer Fabrication Processes: Memory (DRAM, FLASH, ROM, SRAM), Embedded Memory,
Mixed, High Voltage
MANUFACTURING FACILITIES
Wafer Fabs: Four 8 and 12 Inch Fabs, Existing and Planned
Feature Length: 0.13, 0.18, 0.22
Mass Production Date: March 2003
Capital Investment Phase 1: $1.63 Billion
