Information: info@icmechanics.com

URL: www.icmechanics.com   

IC Mechanics offers technology that permits MEMS devices to be directly mounted on top of VLSI circuits. The company's capping technology protects the MEMS devices to increase the reliability during the manufacturing process, which in turn favors a maximum yield and lower overall costs. As well, the capping process permits the MEMS die to be readily used in die form without concerns about MEMS part damage. Finally the process enables the use of low cost plastic packages and industry standard IC package assembly lines to be used to package and assembly MEMS based devices. 

MANAGEMENT

Dr. L. Richard Carley, President, Chief Executive Officer

David F. Guillou, Vice President Engineering

Suresh Santhanam, Director of MEMS Process Development

Dr. Richard S. Payne, Manufacturing Consultant

FAST FACTS

Classification: Micromachines

Funding Report First Round: 2001 (Aug), $5 Million

Investors First Round: Draper Triangle Ventures, Future Fund, G4 Partners, Hunt Ventures, Techno Venture Management

MAIN INTEGRATED CIRCUIT PRODUCTS / TECHNOLOGY

MEMs Cost Optimized Manufacturing Technology