Microfabrica defines itself as an application specific micro device company. Similar in concept to Applictions Specific Integrated Circuits (ASICs), the company's product line, manufacturing capability, and design expertise give customers the option to develop, design and manufacture custom and semi-custom MEMS devices. General prototype turn round time, after the design has been signed off, is in the order of 3 weeks.

MANAGEMENT
Vacit Arat, President and CEO.
Adam Cohen, Executive Vice President Technology, CTO
Chris Bang, Vice President Design / Applications Engineering
Michael Lockard, Vice President Operations
Dr. Kang Sun, Vice President Business Development

BOARD OF DIRECTORS
Vacit Arat
Adam Cohen
Morton Grosser, Ph.D
Wen Kom,  Chairman, FounderWK Technology Fund
David K. Lam, Sc.D.
Keh-Shew Lu, Ph.D., General Partner WK Technology Fund,
Dave Welsh, General Partner at Partech International, an
Richard Whiting, Ph.D., General Partner of DynaFund
David Neubauer, Managing Partner of Atherton Venture Partners
Warren Packard, Managing Director at Draper Fisher Jurvetson.
Don Riley, Director of ChevronTexaco Technology Ventures and
Darius Sankey, Ph.D.,  Zone Ventures

FAST FACTS
Clasification: IC, MEMS, Foundry

Employee Est.: 35
Founded: 1999 (MEMGEN Corporation)
Funding Report Series B: 2004 (Mar), $15 Million
Funding Report Series A1: 2002 (July), $5.7 Million
Funding Report Series A: 2001(Feb) $11 Million
Investors Series B: WK Technology Fund; Atherton Venture Partners, ChevronTexaco
Venture Equities, DynaFund Ventures, Draper Fisher Jurvetson, Partech International, Zone Ventures
Investors Series A: Partech International; Chevron, Draper Fisher Jurvetson, DynaFund Ventures
Investors: Partech International, DynaFund Ventures, Draper Fisher Jurvetson, Chevron Technology Ventures LLC, Atherton Venture Partners, LLC, Venture Law Group, Riordan & McKinzie, Zone Ventures
Patents 2004: 100 United States and Foreign Patents Issued or Pending Related to EFAB MEMS Process and Applications

MAIN INTEGRATED CIRCUIT PRODUCTS / TECHNOLOGY
Foundry Service: Custom, Prototype, Production

MicroMachines:
MicroMechanical: Springs, Pumps, Valves
Micropassives: Coil Inductors, Solenoids, Transformers, Variable Capacitors
MicroFluidics: Nozzles, Well Plates
MicroInstruments: Micro-forceps
MicroOptical: Fiber Optic Alignment, Optical Attenutators, Mirrors

END MARKETS
Automatic Test Equipment: Microsprings
Automotive: Accelerometers, Gyroscopes
Energy: Fuel Cells
Biomedical: Insulin Injectors, Pumps, Surgical Instruments, Valves,
Peripherals: Ink Jet Print Heads, Scanner Lasers and Mirrors
Wireless: Antennas, Filters, RF MEMS, Inductors, Relays,

MANUFACTURING
Process Technology: The EFAB process, an electrochemical fabrication process, has its origins at the University of Southern California. The non-silicon MEMS process permits 100 unique metal layers compared to less than 30 for most silicon MEMs process. The process is capable of  high aspect ratios and manufacturing tolerances. 

In-House Equipment: Self-Contained MEMS Production Machine (Silicon, Metal) is cleanroom less - mitigates the need for a cleanroom.

MANUFACTURING PARTNERS
2005: MOSIS entered into an agreement with Microfabrica for low-cost multiproject micromachine manufacturing.