Micromotive GmbH offers the Octosensis microarrays, which are micromechanical
chips that include eight rectangular cantilever sensors. The cantilever silicon products were a result of a development
project between Micromotive and the Max-Planck-Institute for Polymer Research, also located in Mainz.
Cantilevers, which are beams that are connected to only one side of a structure,
are the basis for many instrument applications. When an object is placed on the non-connected side of a cantilever, the cantilever
will bend a distance that is a function of the weight of the object and the material bending strength of the cantilever. Because
silicon micro cantilevers can be a micron in width and have a length of several hundred microns, micro cantilevers are ideally
suited for atomic measurements.
Micromotive utilizes a SOI etching process for the manufacture of its Octosensis
chips. The process and mechanical structure of its cantilevers results in uniform spring constants and resonant frequencies
(Less than 1 Percent Variance).
Classification: IC, MEMS
MAIN INTEGRATED CIRCUIT PRODUCTS / TECHNOLOGY
Micromechanical Cantilever Sensors