URL: www.micromotive.com

Micromotive GmbH offers the Octosensis microarrays, which are micromechanical chips that include eight rectangular cantilever sensors. The cantilever silicon products were a result of a development  project between Micromotive and the Max-Planck-Institute for Polymer Research, also located in Mainz.

Cantilevers, which are beams that are connected to only one side of a structure, are the basis for many instrument applications. When an object is placed on the non-connected side of a cantilever, the cantilever will bend a distance that is a function of the weight of the object and the material bending strength of the cantilever. Because silicon micro cantilevers can be a micron in width and have a length of several hundred microns, micro cantilevers are ideally suited for atomic measurements.

Micromotive utilizes a SOI etching process for the manufacture of its Octosensis chips. The process and mechanical structure of its cantilevers results in uniform spring constants and resonant frequencies (Less than 1 Percent Variance).

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Classification: IC, MEMS

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Micromachines: Micromechanical Cantilever Sensors