HelloSoft, noted as a supplier of VoIP technology to the integrated
circuit market, has closed an oversubscribed round of funding. The Series B round brought in $16 million from investors that
included TD Capital Ventures, which led the round, as well as Mitsui & Company Venture Partners, Entrepia Ventures, Venrock
Associates, Sofinnova Ventures and Jump Startup.
Krishna Yarlagadda, CEO of HelloSoft indicated that the funding
would be used to further the company’s entrance into the multi-mode handset market, "This latest round of funding demonstrates
investors' confidence in our management team, strategy and roadmap. The new investment will help HelloSoft accelerate its
development of CelluLAN for the burgeoning mobile multi-mode handset market. With its experienced team and an innovative technology
portfolio, HelloSoft will continue focusing on the world's most advanced low-cost and low-power solutions."
Noting HelloSoft’s wireless convergence strategy was Jim Goldinger,
Director and Investment Partner of TD Capital Ventures, “The convergence of Cellular, VoIP, and Wi-Fi technologies is
inevitable and happening at a rate faster than expected. HelloSoft's deep domain experience and expertise in each of these
technologies makes the company uniquely positioned to take advantage of this opportunity. HelloSoft's visionary solutions
will enable cost-efficient mass deployment of multi-mode mobile communications devices for the converged marketplace."
HelloSoft, which counts semiconductor tier one companies in
its client base, has a staff of over 100 digital signal processing (DSP) engineers in Hyderabad, India.
