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September, 2005
WiSpry provides matching funds with NSF for MEMS packaging research
Funding Announcement: September, 2005
Awarded By: National Science Foundation (NSF), Matching Funds from WiSpry
Funding Area: Research and development related to MEMS packaging technologies. Wafer level encapsulation and chip scale interconnection of MEMS devices. Wafers contain through wafer metalized vias.
Research Participants: WiSpry, Sandia National Laboratories, University of Arkansas
URL: www.wispry.com
Industry Keyword: Semiconductor; Product Keyword: MEMS Packaging; Business Keyword: Funding; Market Keyword: ; Product Type Keyword: Electronic
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