Text Box: SEMICONDUCTOR COMPANY NEWS
Alphabetical By Company (A-L), October, 2005

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October 2005: IC News Alphabetical By Company (A  - L)By Company (M-Zo)

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Company

Semiconductor News Alphabetical By Company (A-L)

 

ADMET Inc.

ADMET introduces ADMET nmTester to test materials properties and MEMS device

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Advanced MicroSensors

AMS supplying Tandberg with magneto-resistive tape heads

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AeA Classic

Halla to speak at AeA

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AGEIA Technologies Inc.

ChessBase licenses AGEIA's PhysXSDK to develop chess game

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Agere Systems

Agere Systems delivers Vision X115 chipset for video cell phone applications

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Agilent Technologies

King Yuan Electronics selects Agilent’s 93000 Pin Scale system to test complex SOCs

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Agilent Technologies

Agilent introduces 1.2 megapixel CMOS image sensors, plans to sample 2 megapixel version in early 2006

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Alereon

Alereon introduces UWB chip family

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All American Semiconductor

All American Semiconductor, Inc., major electronic component distributor,  reports third quarter revenues

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AMD

AMD opens 12 Inch Wafer Fab in Germany, Fab 36

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AMD

AMD reports third quarter revenue 23 % higher, year-over-year, microprocessor sales up 44 percent year-over-year, 26 percent sequentially

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AMI Semiconductor

AMI Semiconductor qualifies Cavendish Kinetics’ embedded One-Time Programmable (OTP) core technology for foundry

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AMI Semiconductor

AMI Semiconductor announces embedded software tool and communication accelerator

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AMI Semiconductor

AMI introduces very small stepper motor controller chips

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AMI Semiconductor

AMI Semiconductor wins $6.6 million contract

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Anadigics

ANADIGICS introduces highly linear amplifier for high picture quality

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Analog Devices

Holley Communications selects Analog’s SoftFone LCR chipset for 3G TD-SCDMA cellular headset solution

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Analog Devices

ZTE Corporation designs in Analog Devices' SoftFone-LCR chipset and Datang Mobile's solution into 3G Cellular TD-SCDMA

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Analog Devices

Analog Devices introduces iSensor intelligent motion sensor

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Analog Devices

Analog Devices to supply 3G cellular chipsets to China’s Holley

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ARM

VeriSilicon licenses ARM’s microprocessor IP cores

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Artesyn Communication

Artesyn Communication Products introduces ProcessorPMC protocol engine

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Atmel

Atmel and Texas Instruments provide solution for HD-Radio

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Atmel

FingerGear introduces Bio Computer-On-a-Stick (BCOC)

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AuthenTec

AuthenTec demonstrates biometric cell phone application

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Axcelis Technologies

UMC places follow on order with Axcelis for RadiantStrip 320Lk system

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BridgeCo

BridgeCo releases BeBoB 1394 audio interface software

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Broadcom

Broadcom opens office in Cambridge

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BroadLight

BroadLight presents GPON on a chip

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Cabot Microelectronics

Samsung Electronics selects Cabot Microelectronics as Best

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California Micro Devices

CMD passes one billionth ASIP shipment

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Cascade Microtech

Cascade Microtech reports on liquid and electrical field microport product - to enable generation of micro electrical fields

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Cavendish Kinetics

AMIS qualifies Cavendish core technology for foundry

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CEVA

National integrates CEVA’s Xpert Teak DSP core into Bluetooth

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CEVA

CEVA introduces CEVA-SAS IP core

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Challenger Gray & Christmas Inc.,

Challenger, Gray & Christmas Inc. report high-tech still downsizing

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Chipcon AS

Cirronet integrates Chipcon’s chip into its ZigBee products

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Cirrus Logic

Cirrus reports second quarter revenue, core product revenue gains

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Conexant Systems

Conexant introduces ADSL2plus chipset

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Cree Inc.

Permlight ships cabinet lighting fixtures equipped with Cree’ durable LEDs

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Cree Inc.

Cree Reports Revenue Exceeds $100 Million for first time

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Cypress Semiconductor

Cypress reports third quarter revenue up 3.0 percent

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Cypress Semiconductor

Cypress introduces USB 2.0 programmable microcontroller

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Cypress Semiconductor

Cypress introduces 2.4GHz Wireless USB ROC

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DALSA

DALSA named to Deloitte's Canadian Technology Fast 50

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DiBcom

DiBcom appoints Patrick J. Lubinski as VP Sales

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E Ink,

E Ink  and LG Philips LCD develop 10.1 inch flexible electronic display

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eASIC

eASIC and INNOTECH enter into distribution and technical support agreement

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eASIC

eASIC receives $17.5 million in funding

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Eastman Kodak

Eastman Kodak Product Introductions, High Resolution Image Sensors - reports customer

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Eksigent Technologies

Eksigent, microfluidic company, expands

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eMagin

eMagin  Funding / Financing Report

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Ember Corp.

Ember begins shipments of EM250 ZigBee system on a chip

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Ember Corp.

Ember Corporation receives investment from In-Q-Tel

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Entegris

Entegris Conference Attendance

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ESI

Hynix Semiconductor orders ESI’s Model 9830

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ESI

ProMOS Technologies orders ESI's Model 9830

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Eudyna

Report indicates Eudyna is leader in GaAs market

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Evigia Systems

NASA selects Evigia Systems for MOS MEMS accelerometer development contract

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EZchip Technologies

EZchip Technologies and TeraChip announce interoperable switching architecture

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Fairchild

Toshiba Carrier Corporation selects Fairchild Semiconductor’s power module

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Fairchild

Toshiba Carrier Corporation selects Fairchild Semiconductor’s power module

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Fairchild Semiconductor

Fairchild Semiconductor reports flat sequential third quarter revenue

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Fidus Systems

Fidus Systems reports $1.4 million in signed contracts

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FOCUS Enhancements

FOCUS  introduces TALARIA Ultra Wideband (UWB) Evaluation System

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FormFactor

FormFactor reports revenues up 19 percent

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Freescale Semiconductor

Freescale and Jungo to deliver residential and business gateway platforms

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Freescale Semiconductor

Freescale and FSS develop IPSec VPN-based security routers

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Freescale Semiconductor

Freescale introduces DSP firmware for Dolby audio applications

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Freescale Semiconductor

Freescale acquires CommASIC

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Freescale Semiconductor

NESA utilizes Freescale's ZigBee compliant platform

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Freescale Semiconductor

Freescale reports on 90 nanometer chip production

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Freescale Semiconductor

Freescale demonstrates HSDPA streaming video

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Global IP Sound

Global IP Sound reports more chip and handset licensees

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GSPx

AccellChip presents paper on fixed point

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Honeywell

Honeywell obtains patent for nanotube sensor

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Hynix Semiconductor

Hynix orders ESI’s Model 9830

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IBM

ZF Micro Solutions enters into multi-year foundry agreement with IBM

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IC Interconnect

IC Interconnect qualifies Ni/Au pad resurfacing wafer bump process

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IC Packaging Technology Expo

IC Packaging Technology Expo

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Ikanos

Ikanos reports third quarter revenue up 39 percent

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IMEC

TSMC becomes partner in IMEC sub-45 nanometer CMOS research program

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Infinicon

INFICON reports third quarter revenue up 4.1 percent

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INNOTECH

eASIC and INNOTECH enter into distribution and technical support agreement

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Inphi

Inphi introduces DDR2-SDRAM interface

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Integral Vision

Integral Vision receives another order for SharpEye inspection

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Integrated Device Technology

Ample Communications selects IDT’s network search engine for Internet Appliance solution

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Integrated Device Technology

IDT passes 7 Million Network Search Engine Chip Shipments

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Integrated Device Technology

Bay Microsystems selects IDT's as preferred partner, Network Search Engines chip

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Intel Corp

Intel reports third quarter revenue up 18 percent

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Intel Corp

Intel to support new Cisco Compatible 4.0 Extensions for Wi-Fi solution

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InterDigital Communications

InterDigital Communications introduces UMTS Release HSDPA coprocessor

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Intermec

Intermec's laser scanner based on MEMS technology

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International Rectifier

International Rectifier introduces IRF6648, a 60V DirectFET power MOSFET

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International Rectifier

International Rectifier awarded $6.241 million

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International Rectifier

International Rectifier opens assembly and test facility for power management chips

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Intersil

Intersil Corporation reports third quarter revenue up 24 percent

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Intersil Corporation

Intersil introduces low dropout regulator

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IPextreme

IPextreme to offer Freescale’s FlexRay communication controller IP core

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IPFlex

IPFlex Inc. begins taking orders for IPFlex FFT Development Kit

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Isonics

Isonics introduces toxic chemical detection system

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ISSSY

ISSSY completes $1.97 million NIST Advanced Technology Program

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ISSYS

ISSYS to supply MEMS components for KEM’s Micro Density Meter products

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ISSYS

ISSYS to present at Fuel Cell Conference

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ISSYS

ISSYS obtains patent for micromachine lysing devices.

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ISSYS

ISSYS receives grant from Michigan Technology Tri-Corridor Fund

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King Yuan Electronics

King Yuan Electronics selects Agilent’s 93000 Pin Scale system to test complex SOCs

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Knowles Electronics

Dover Corp. acquires Knowles Electronics for $750 million

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Koncern Nauchny Center, KNC

Infineon transfers chip assembly technology to  Russian company

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Kopin Corp

Kopin  and Solomon win honors

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Lawrence Berkeley National Laboratory

Berkeley Labs applies NMR to microfluidic chip technology

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Lehman Brothers Global Technology Conference

Cirrus Logic announces conference schedule

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LG Philips

E Ink Corporation and LG Philips LCD develop a 10.1 inch flexible electronic display

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Lockheed Martin

Lockheed Martin obtains patent for carbon nanotube

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LSI Logic

LSI Logic obtains patent for memory cell based on nanotube technology

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Luna Innovations

NASA awards contract for MEMS sensor development  to Luna

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