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August 15th, 2005
Ziptronix, known for its three-dimensional integrated circuit vertical
interconnect technology, has raised $7.2 million in a Series C round. The round’s investors included Alliance Technology
Ventures, Grotech Capital, Intersouth Partners, NC IDEA, Research Technology Ventures, and RTI International. Ziptronix indicates
that the funds will be used for the further expansion of its sales and marketing efforts as well as to add new partners.
The company's 3D IC technology permits the vertical stacking of
integrated circuits, enable smaller footprints, lower electronic system power and faster system speeds. The company also indicates
that vertical integration also lowers the costs of integrated circuits.
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