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August 15th, 2005
RoseStreet Labs has opened a 3D Research and Development laboratory
in Phoenix, Arizona focused on the development of advanced semiconductor packaging technology. At the facility, RoseStreet
and its subsidiary FlipChip International will develop new materials and processes for the packaging of wireless devices.
As well, through an alliance with SUSS MicroTec, the facility is expected to be equipped with a full range of lithography
and 3D packaging equipment from SUSS. The laboratory offers R&D contract services for polymer, metal deposition, lithography,
3D packaging, System-in-Package, MEMS packaging and interconnect development. Summing up the five year plan was Bob Forcier,
CEO of RoseStreet Labs, "This opening of our new R&D lab and our alliance with our close partner, SUSS MicroTec, is part
of our five year technology roadmap to provide next generation solutions to our valued customers in the areas of wafer level
MEMs, sensor, System-In-Package and advanced 3D packaging. We are very excited by this milestone and will continue to invest
in advanced technology."
RoseStreet Labs, LLC, bills provides its services and products
for applications in the life sciences, wireless and renewable energy markets. RoseStreet in April of this year entered
into a solar cell commercialization agreement with Cornell University.
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