Cubic Wafer, in anticipation of growth form its 3D stacking technology,
has relocated its headquarters to Austin, Texas and naming Ed Healy, chief executive officer and Abhay Misra as vice president
of operations and engineering. According to Russ Johnsen, chairman of the board of Cubic Wafer. "The benefit of having a management
team in place with the skills Ed and Abhay bring is their ability to immediately capitalize on our technology by implementing
a strategic plan for achieving a revenue stream in the short term without losing sight of our long-term objectives. We are
confident Cubic Wafer is positioned to create an industry shift to transform and advance the integration possibilities of
the semiconductor industry."
Cubic Wafer indicates that its process technology for the vertical
integration of silicon die will offer solutions for consumer electronic products such as cameras, PCs printers, and wireless
devices.
The two new members of Cubic’s team plan to establish partnerships
with chip companies to enable dramatic reduction of chip production costs. Specifically targeted are high volume Asian foundries,
assembly and packaging companies.
Cubic Wafer’s process technology is used to fuse integrated
circuits at the die or wafer level. The company bills the technology as “The chip becomes the board.” This
technology can be used to bond together chips manufactured with different process technologies such as analog and digital
CMOS processes with over a million communication contacts per square centimeter. These contacts or bonds are reported to be
one-thousand time shorter than the IO connections found on today’s horizontal chips. The reduction of IO length portends
to lower power and higher speed chip solutions. The company also indicates that it solution combines the best advantages
of system-in-packaging and system-on-chip design methodologies to obtain a very cost-effective, smaller, faster, and lower
power solution.
