THE SEMICONDUCTOR EVENING NEWS
September 13th, 2005
TechnoConcepts Inc. (OTCBB:TCPS) has reported that it has entered
into an agreement with China’s largest semiconductor and chip design company, China Electronics Corporation (CEC). As
part of the agreement, TechnoConcepts’ patented RF/D technology will be integrated into cellular handsets manufactured
by CEC’s subsidiaries. TechnoConcepts will receive a license fee on each handset manufactured. License fee revenues
is expected to begin in the first quarter of 2007.
Techno’s RF to Digital technology will permit triple play
services for 3G cell phone users. Cell phone users, with phones based on the technology, will be able to select different
network connections to receive voice, data or video – anyplace and anytime. The company indicated that the technology
would enable mobile phone users to have service even in disaster situations such as Hurricane Katrina.
CEC Wireless ("CECW") and/or Great Wall Computer will manufacture
the 3G handsets, which are expected to be produced in high volume. According to Antonio Turgeon, chairman and CEO of TechnoConcepts,
"While our technology has been successfully demonstrated for major electronics manufacturers in both China and South Korea,
this agreement with CEC marks a significant milestone for Techno as it is the first agreement which calls for our technology
to be incorporated into a consumer device for large scale distribution."
Mr. Turgeon added more market details, "We believe our technology
will ultimately be incorporated in numerous communication applications and devices to be manufactured and distributed by many
of the world's largest companies to be used by millions of people all over the world. But today's announcement is in many
ways is a 'bull's-eye' for Techno. It is for deployment of our technology in the largest vertical market (cellular phones)
we have identified, by the largest IT Company in China, in the largest market (China) in the world. There is no mistaking
that China is the growth engine for telecommunications and 3G technologies. Estimates are that China adds approximately five
million mobile-phone users each month."
China Electronics Corporation, which sold over 20 million cell phones
in 2004, employs approximately 34,000 employees.
Accelrys, Inc. (NASDAQ:ACCL) has introduced ONETEP, a nanodesign
tool developed in conjunction with the members of the Accelrys Nanotechnology Consortium. The consortium was formed to expedite
the development of nanomaterials and nanodevices. Mark J. Emkjer, CEO of Accelrys commented on ONETEP broad applicability,
"With the launch of the ONETEP software solution, the first deliverable against our target of increased accuracy, capabilities
and performance across a broad range of nanoscale applications, the Consortium is well on its way to fulfilling the promise
of furthering the rational design of nanomaterials and nanodevices. With the Consortium's membership continuing to grow, we
are well positioned to develop novel technologies that meet the needs of the scientists and engineers who are participating
in and building the nanotech industry."
Noting the value of nanodevice simulation was Bob Daniels, vice
president of research and development at Lyondell Chemical Company, "We recognize the potential value of molecular modeling
as a means of reducing the cost of new materials research. Accelrys has created a collaborative nanotechnology forum where
Lyondell's needs for specific modeling capabilities are being satisfied. We will deploy these tools to real-world problems
to provide solutions that create a strategic advantage in an increasingly complex and competitive market."
Specific
applications for the ONETEP nanosimulator include nanotubes, mixed bio-materials systems and oxide nanoparticles.
The consortium, which just added seven members, includes organizations
from industry, the academic world and government. The new members include Kyoto University, Millennium Chemicals (A Lyondell
Company), R.J. Mears, CSIC of Spain and PPG Industries. Other members include Corning Incorporated, Fujitsu, e2v Technologies,
Imperial College, Uppsala University, Johnson Matthey, Schenectady International, Fraunhofer IFAM, Fraunhofer IZM and the
Japan Advanced Institute of Science and Technology.
Jennic, a fabless semiconductor company, has released the JN5121
IEEE 802.15.4 wireless microcontroller to meet ZigBee standard applications. The chip, now in volume production, integrates
a 32-bit RISC core, a 2.4 GHz IEEE 802.15.3 transceiver as well as ROM and RAM memory. The chip is intended to meet the design
requirements of a variety of low-power sensor network applications for the home, buildings and industry.
The chip was manufactured on IBM’s 7RF low-cost RF CMOS process.
K-Micro, also known as Kawasaki Microelectronics, has selected Sonics’
Smart Interconnect IP core technology for inclusion into its ASIC cell library for the design of low-power, mobile and consumer
based SoCs. . Sunil Baliga, vice president of marketing and business development at K-Micro indicated that Sonics MX technology
would enable its ASIC customers to lower power consumption and reduce silicon area needs, "The low-power, high performance,
and small silicon area breakthroughs achieved in SonicsMX are impressive. "We have already successfully executed designs using
Sonics SMART Interconnects and are very comfortable with the technology. Therefore, adding Sonics' MX to our SoC IP portfolio
was a natural choice for us as we look to satisfy the needs of customers designing low-power applications."
Silicon Integrated Systems, one of Taiwan’s major fabless
chip companies, has reported that Fujitsu Siemens Computers will use its chips in the design of its professional PC line.
The computers, the ESPRIMO E5600 and ESPRIMO P5600, will use the SiS761GX integrated Northbridge chipset. The ESPRIMO series
is intended for the business desktop PC market.
Agoura Technologies, based in Sacramento, California, has closed
on an investment from American River Ventures. Agoura is involved in the development of nanotechnology-based optical films
that have applications in the semiconductor, display, storage and wireless industries. The company’s CEO is Mike Little;
former Chief Technology Officer of Solus Micro Technologies, optical MEMS based tunable filter company. Mr. Little has been
awarded over 39 patents and has six patents pending.
