Muva nje, ithimba labacwaningi be-BOE lishicilele iphepha elinesihloko esithi I-Novel Package Design Ithuthukisa Ukusebenza Okubonakalayo Kwezibonisi ze-Micro LED kujenali Isibonisi Solwazi.

Inqubo Yedizayini Yokuhlanganisa I-Micro-LED Display Microstructure Packaging (Umthombo wesithombe: Isibonisi Solwazi)

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Ucwaningo luhlongoza uhlelo lokupakisha lwe-Micro LED olusha, olusingatha ngempumelelo izinselelo zobuchwepheshe zemboni ezifana nokukhishwa okuqinile kwe-sidewall yama-micro LED chips, ukusebenza kahle kokukhanya okuphansi kokusetshenziswa kwamandla, kanye nokushintshwa kombala.

Kubikwa ukuthi njengoba usayizi wephikseli uncipha ube ngaphansi kuka-50μm, indawo ehlobene yodonga oluseceleni lwe-chip iyanda, okuholela ekuthuthukisweni kokuphuma kwe-lateral nokunciphisa ukuphuma okuphezulu kwama-Micro LED. Lokhu kubangela ukulahleka kokukhanya nokuchezuka kombala, kukhawulela ukusetshenziswa kwama-Micro LED kuzimo zokubonisa ezinemba okuphezulu.

Ukuze kubhekwane nalolu daba, ithimba labacwaningi be-BOE lenze isakhiwo sokupakisha esiyinhlanganisela esihlanganisa inkomba ebonisa ngale enamathelayo enenkomba ephezulu, i-resin ekhanyayo emhlophe, ama-microlens arrays, kanye ne-matrix emnyama enephethini (BM).

Ngokwethula isendlalelo senkomba ye-gradient refractive kuma-Micro LED chips, abacwaningi bathuthukise ngempumelelo i-engeli yokuphuma yokukhanya kusukela phezulu kwe-chip, bakhulisa i-engeli ebalulekile ukusuka kumadigri angu-25 ukuya kubukhulu obungu-65.9 degrees futhi bathuthukisa kakhulu ukusebenza kahle kokukhipha ukukhanya okuphezulu.

Ngaleso sikhathi, i-resin ekhanyayo emhlophe yenza isakhiwo se-isosceles trapezoidal phakathi kwama-chips, angagxilisa futhi asakaze ukukhanya, okwandisa ukukhanya ku-engeli yokubuka engu-0° cishe ngo-27%. Ukwengeza, inqubo ye-plasma yokukhipha ingcina eyinsalela iqinisekisa ukuphuma kokukhanya okungavinjelwe.

Mayelana nokulawulwa kokukhanya, ithimba lasebenzisa ubuchwepheshe be-nanoimprint lithography ukuze lenze ama-microlens array anembe kakhulu, lithole ukuhlangana okusebenzayo kokukhanya ngaphakathi kuka-±60°.

Imiphumela yokulingisa ibonisa ukuthi lapho i-lens curvature ingu-0.03 kanye ne-refractive index ingu-1.85, amandla okukhanya akhuphuka ngaphezu kuka-53%. Ngaphezu kwalokho, ucwaningo lwethule i-matrix emnyama enephethini kungqimba lwengilazi yokupakisha, yehlisa ngempumelelo ukubukeka kwayo ibe ngaphansi kuka-2% futhi yazuza isilinganiso esiphezulu sokungafani esidlula u-20,000:1, okuthuthukisa kakhulu ikhwalithi yokubonisa.

(a) Isakhiwo se-Micro LED, (b) Indlela yokukhipha ukukhanya ngaphakathi kwe-chip, (c) Ukusabalalisa ukukhanya (Umthombo wesithombe: Isibonisi Solwazi)

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Ithimba labacwaningi be-BOE lithe lolu hlelo aluzuzi nje kuphela impumelelo ekusebenzeni kahle nokufana kodwa futhi lubheka ukwethembeka kokupakishwa. Inhlanganisela yekhava yengilazi kanye nongqimba lwe-OCA (Optically Clear Adhesive) ithuthukisa izinto ezingangeni manzi, ezilwa ne-oxidation, nezindawo ezingagugi, inikeze indlela ethembekile yokusetshenziswa kokukhiqiza okukhulu kwama-Micro LED emikhakheni efana nezibonisi zezimoto, amahedisethi e-AR/VR, namadivayisi agqokekayo.

I-BOE ayifinyelelanga kuphela imiphumela yakamuva yocwaningo lwe-Micro LED kodwa futhi iyaqhubeka nokukhuthaza ukuthuthukiswa kobuchwepheshe bokubonisa okuqondile be-Mini/Micro LED kanye nezinhlelo zokusebenza.