Muva nje, ithimba labacwaningi le-BOE lishicilele iphepha elinesihloko esithi Novel Package Design Enhances Optical Efficiency of Micro LED Displays ephephabhukwini i-Information Display.

Inqubo Yokuklama Ukupakisha Isakhiwo Esincane Se-Micro LED Display (Umthombo Wesithombe: Ukuboniswa Kolwazi)

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Lolu cwaningo luphakamisa uhlelo olusha lokupakisha lwe-Micro LED, olubhekana ngempumelelo nezinselele zobuchwepheshe embonini njengokukhishwa okunamandla kwama-micro LED chips eceleni, ukusebenza kahle kwamandla okukhanya okuphansi, kanye nokushintsha kombala.

Kubikwa ukuthi njengoba usayizi wephikseli uncipha ube ngaphansi kwama-50μm, indawo ehlobene nodonga lwe-chip iyanda, okuholela ekukhushulweni kokukhishwa kwe-lateral okuthuthukisiwe kanye nokwehla kokukhishwa okuphezulu kwama-Micro LED. Lokhu kubangela ukulahlekelwa ukukhanya kanye nokuphambuka kombala, okuvimbela ukusetshenziswa kwama-Micro LED ezimweni zokubonisa ezinembe kakhulu.

Ukuze kuxazululwe le nkinga, ithimba locwaningo le-BOE lakha isakhiwo sokupakisha esihlanganisiwe esakhiwe nge-adhesive transparent-index high-refractive-index, i-resin emhlophe high-reflective, ama-microlens arrays, kanye ne-patterned black matrix (BM).

Ngokungenisa ungqimba lwe-gradient refractive index kuma-Micro LED chips, abacwaningi bathuthukise ngempumelelo i-engeli yokuphuma kokukhanya kusuka phezulu kwe-chip, bakhulisa i-engeli ebalulekile kusuka kuma-degrees angu-25 kuya kuma-degrees angu-65.9 futhi bathuthukisa kakhulu ukusebenza kahle kokukhipha ukukhanya okuphezulu.

Okwamanje, i-resin emhlophe ekhanyayo yakha isakhiwo se-trapezoidal esi-isosceles phakathi kwama-chips, esingagxila futhi sisakaze ukukhanya, okwandisa ukukhanya ekhoneni lokubuka elingu-0° cishe ngo-27%. Ngaphezu kwalokho, inqubo ye-plasma yokususa ingcina eseleyo iqinisekisa ukukhishwa kokukhanya okungavimbelwe.

Ngokuphathelene nokulawula ukukhanya, ithimba lisebenzise ubuchwepheshe be-nanoimprint lithography ukwakha ama-microlens aqinile kakhulu, okufeza ukuhlangana okuphumelelayo kokukhanya ngaphakathi kuka-±60°.

Imiphumela yokulingisa ikhombisa ukuthi lapho ukugoba kwelensi kungu-0.03 kanye nenkomba yokukhanya ingu-1.85, ukuqina kokukhanya kuyanda ngaphezu kuka-53%. Ngaphezu kwalokho, ucwaningo lwethule i-matrix emnyama enephethini engqimbeni yengilazi yokupakisha, kunciphisa ngempumelelo ukubonakaliswa kube ngaphansi kuka-2% futhi kwafezwa isilinganiso sokungafani okuphezulu esidlula u-20,000:1, okuthuthukisa kakhulu ikhwalithi yokubonisa.

(a) Isakhiwo se-Micro LED, (b) Isiqondiso sokukhishwa kokukhanya ngaphakathi kwe-chip, (c) Ukusatshalaliswa kokukhanya (Umthombo wesithombe: Ukuboniswa Kolwazi)

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Ithimba locwaningo le-BOE lithe lolu hlelo alugcini nje ngokufeza intuthuko ekusebenzeni kahle kokukhanya kanye nokufana kodwa futhi lubheka ukuthembeka kokupakisha. Ukuhlanganiswa kwesembozo sengilazi kanye nesendlalelo se-OCA (Optically Clear Adhesive) kuthuthukisa izakhiwo ezingangeni manzi, ezilwa ne-oxidation, kanye nezingagugi, okunikeza indlela ethembekile yokusetshenziswa kokukhiqiza ngobuningi kwama-Micro LED emikhakheni efana nezibonisi zezimoto, ama-headset e-AR/VR, kanye namadivayisi agqokwayo.

I-BOE ayigcinanga nje ngokuthola imiphumela yocwaningo lwakamuva lwe-Micro LED kodwa futhi iyaqhubeka nokukhuthaza ukuthuthukiswa kobuchwepheshe bokubonisa ngqo be-Mini/Micro LED kanye nezinhlelo zokusebenza.