According to South Korean media reports, LG Display has produced a 27-inch OLED prototype with 160 PPI (pixels per inch) using its FLiPP process on the Gen 8.5 OLED pilot line, and unveiled the sample for the first time at the IMID 2026 exhibition.

FLiPP is LG Display’s proprietary OLED manufacturing process that eliminates the need for Fine Metal Masks (FMM) and achieves pixel patterning via photolithography. The process first evaporates RGB organic materials across the entire substrate, then uses ultraviolet (UV) light to precisely remove unwanted sections, ultimately forming well-defined pixels.

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At IMID 2026 held at BEXCO in Busan, LG Display showcased its in-house developed FLiPP OLED pixel patterning technology. Choi Yong-seok, Chief Technology Officer (CTO) of LG Display, stated in a media interview: “FLiPP is still in its early stages. We are advancing technological improvements across multiple dimensions, and we expect it to deliver an unprecedented paradigm shift in OLED manufacturing.”

Per the company, FLiPP technology can directly leverage LG Display’s existing Gen 8.5 production line infrastructure and make full use of the mother glass. When producing panels of the same size, FLiPP boosts substrate cutting utilization by up to 64% compared with conventional FMM-based processes and competing FMM-free solutions, reducing waste from mother glass trimming while improving production efficiency and cost competitiveness.

Recent industry reports reveal that LG Display will hold an internal meeting this September to finalize the equipment specifications and co-investment plan for its new-generation FLiPP OLED technology, with plans to place equipment procurement orders next January.

The total investment amounts to 3 trillion won (approximately RMB 14.37 billion). The funds will cover not only production equipment procurement but also the expansion of supporting infrastructure such as power and water supply required for line operation. Since FLiPP technology requires new deposition, photolithography, etching and logistics equipment adapted for large-size Gen 8 substrates, power and water consumption for photolithography and cleaning processes will rise significantly, making the expansion of supporting infrastructure a necessary step.