On May 5 local time, at the SID Academic Forum, Chen Faxiang, technical expert at Visionox, delivered an invited keynote speech and announced that Visionox has taken the lead in launching a mass-production solution for high-mobility ALD (Atomic Layer Deposition) all-oxide technology.

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Adopting the ALD process, Visionox has pushed the single-gate mobility of all-oxide TFTs beyond 50 cm²/V·s and successfully powered on a 6.39-inch all-oxide panel. Verification shows that the technology has initially satisfied performance requirements in film-forming precision, stability and uniformity, creating a new path for OLED backplanes that balances high performance, process efficiency and full-size scalability.

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Mobility Exceeds 50 cm²/V·s;
ALD Unlocks High-Performance Ceiling for All-Oxide Technology
In the existing OLED backplane technology ecosystem, LTPS has long dominated the high-performance track thanks to its superior mobility. However, it is heavily reliant on the Excimer Laser Annealing (ELA) process, which involves complex procedures and high costs. Traditional oxide solutions excel in large-area uniformity yet are limited by low mobility, restricting their use from high-end premium applications. The introduction of the ALD process offers a new solution to this long-standing industry challenge.
ALD is essentially a layer-by-layer film deposition technology. Unlike conventional PVD (Physical Vapor Deposition), which deposits materials in a single bulk coating, ALD grows thin films one atomic layer at a time with ultra-fine control at every step. As a result, ALD-produced thin films feature precise thickness, uniform distribution and exceptional stability, laying a solid material foundation for high-performance oxide TFTs.
For display backplanes, carrier mobility is a core metric of TFT driving capability, directly affecting pixel response speed, charging efficiency and driving performance in high-resolution scenarios. By adopting the ALD process, Visionox has achieved a single-gate mobility of over 50 cm²/V·s and a dual-gate mobility exceeding 80 cm²/V·s for all-oxide TFTs, reaching world-leading levels. This means all-oxide backplanes now possess sufficient driving capability for high-end small-size applications. Visionox will continue advancing the mass production of this technology in the next phase.
More importantly, this all-oxide technology delivers high-performance driving without complex ELA processes, fundamentally simplifying manufacturing workflows and improving production efficiency.
Faster Refresh, Narrower Bezels, Lower Power Consumption — Performance Upgrade Elevates Display Experience
The improved mobility translates directly into tangible enhancements in user display experience.
First, higher refresh rates. In actual use, each frame requires pixel refreshing within an extremely short time window. Stronger device driving capability enables faster pixel response, easily supporting smooth visuals at high refresh rates.
Second, narrower bezels and higher screen-to-body ratio. With stronger driving capability, pixel circuits can be further miniaturized while maintaining equivalent display quality, occupying less layout space and enabling more compact structural design. This not only optimizes the industrial design of end devices, but also supports displays with higher pixel density.
In addition, the technology enables stable display at low refresh rates. For standby mode and static image scenarios requiring prolonged frame retention, upgraded device performance better sustains pixel states, reducing screen flicker and brightness fluctuation — achieving stable visuals while cutting power consumption.
First Small-Size Panel Powered On — Expanding Application Boundaries of All-Oxide Technology
Building on performance breakthroughs, Visionox has successfully powered on a small-size all-oxide panel for the first time. Previously, limited by low mobility, all-oxide backplanes were mainly applied to medium-size displays. The successful activation of the small-size panel marks that this technical route is now ready for high-end premium applications, redefining the application boundaries of oxide backplanes.
Verification confirms the ALD solution has met mass-production specifications in key process indicators: wafer-to-wafer film thickness fluctuation below 2% and film thickness uniformity within 4%. This demonstrates outstanding stability and repeatability in mass manufacturing, fully meeting the consistency standards of panel production. Currently, the technology has completed verification on the 4.5G production line and is scalable to higher-generation fabs.
Upholding the spirit of "aspiring, daring and capable of innovation", Visionox leverages nearly 30 years of technological accumulation and industrialization experience to tackle core bottlenecks constraining industry development. The high-mobility ALD all-oxide technology achieves performance upgrades within a single oxide system, without relying on complex multi-material combinations. Featuring high performance, high process efficiency and full-size scalability, it is poised to become a pivotal technical route for future OLED development and deliver greater value in the new round of display technology competition.
Post time: May-08-2026
