According to "Maiyun Display", on December 17th, Maiyun successfully lit up its first independently developed AM-Micro LED module. This module is fabricated using an innovative "optoelectronic co-packaging" device—Driver-MIP (Micro LED in Package) technology, integrating a silicon-based driver IC and Micro LED tricolor light-emitting chips. This marks a breakthrough in Micro LED display technology beyond the limitations of traditional commercial displays, as the key technical bottleneck for entering broader consumer application scenarios has been overcome.
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As a pioneering explorer in the field of Micro LED technology, Maiyun, together with its partners, has successfully developed the industry's first silicon-based driver IC with a size of less than 100 microns based on a 90nm process. Through Fan-Out Wafer Level Package (FOWLP) technology, the driver IC achieves high-density interconnection with Micro LED tricolor light-emitting chips, resulting in the Driver-MIP chip. This has successfully replaced the traditional TFT array driving scheme, realizing the first large-size active matrix (AM) Micro LED display driven by non-TFT technology.
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The successful lighting of this industry-first non-TFT AM-Micro LED display module prototype fully demonstrates Maiyun's core competitiveness and profound technological accumulation in the field of new semiconductor display technologies. In the future, Maiyun will continue to collaborate with industry partners to jointly promote the commercialization of Micro LED technology.
Post time: Dec-25-2025