On February 3rd, South Korean media ETNews reported the previous day that Samsung Electro-Mechanics is pushing forward the commercialization project of semiconductor glass substrates, and it has been confirmed that the company has transferred the relevant business from its original Advanced Technology R&D Organization to its business division.

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According to industry sources, the restructured semiconductor glass substrate project falls under the jurisdiction of the Packaging Solutions Division. An industry insider familiar with the matter stated: "This move means Samsung has started gearing up for full commercialization. It is not only ensuring the availability of relevant core technologies, but also preparing for mass production and market supply."

It is reported that semiconductor glass substrates represent the industry’s next-generation technology. Replacing traditional plastics with glass materials can significantly boost performance: the substrates feature less warping and enable the easier fabrication of fine-pitch circuits. Currently, major enterprises including Samsung Electronics, Intel, Broadcom, AMD and Amazon AWS are all advancing the development of this technology.

Samsung Electro-Mechanics announced its entry into the semiconductor glass substrate industry in early 2024. The company built a pilot production line for glass substrates last year, and in November, it decided to establish a joint venture with the chemical material giant Sumitomo Chemical Group to accelerate the manufacturing and supply of core materials.

Meanwhile, Samsung Electro-Mechanics is addressing remaining technical challenges while attempting to establish the relevant supply chain. The company targets mass production after 2027 and is currently jointly developing samples with global customers.