Ka la 9 Phato, Mopresidente oa Amerika Biden o ile a saena "Molao oa Chip le Saense", ho bolelang hore kamora lilemo tse ka bang tharo tsa tlholisano ea lithahasello, molao ona, o bohlokoa haholo nts'etsopele ea indasteri ea tlhahiso ea li-chip tsa lehae United States, o fetohile molao ka molao.

Ba bangata ba nang le boiphihlelo indastering ea li-semiconductor ba lumela hore potoloho ena ea ketso ea United States e tla potlakisa ho etsoa ha indasteri ea li-semiconductor ea Chaena sebakeng sa heno, 'me Chaena e ka boela ea sebelisa mekhoa e tsoetseng pele ho sebetsana le eona.

"Molao oa Chip le Saense" o arotsoe likarolo tse tharo: Karolo A ke "Molao oa Chip oa 2022"; Karolo B ke "Molao oa R&D, oa Tlholisano le oa Boqapi"; Karolo C ke "Molao oa Tšireletso ea Lichelete oa Lekhotla le ka Holimo-limo la 2022".

Bili ena e shebane le tlhahiso ea li-semiconductor, e tla fana ka $54.2 bilione bakeng sa liindasteri tsa li-semiconductor le tsa seea-le-moea, tseo $52.7 bilione ea tsona e reretsoeng indasteri ea li-semiconductor tsa US. Bili ena e boetse e kenyelletsa mokitlane oa lekhetho la matsete oa 25% bakeng sa tlhahiso ea li-semiconductor le lisebelisoa tsa tlhahiso ea li-semiconductor. 'Muso oa US o tla boela o abele $200 bilione lilemong tse leshome tse tlang ho khothaletsa lipatlisiso tsa mahlale bohlaleng ba maiketsetso, liroboto, k'homphieutha ea quantum, le tse ling.

Bakeng sa lik'hamphani tse etellang pele tsa semiconductor ho eona, ho saena ha bili ha ho makatse. CEO oa Intel, Pat Gelsinger, o boletse hore bili ea chip e kanna ea ba leano la bohlokoa ka ho fetisisa la indasteri le hlahisitsoeng ke United States ho tloha Ntoeng ea II ea Lefatše.