Kutshanje, imakethi ye-storage chips ibijongene nokunyuka okukhulu kwamaxabiso, okuqhutywa yimfuno enkulu yamandla ekhompyutha e-artificial intelligence (AI) kunye nohlengahlengiso lwesakhiwo kwikhonkco lobonelelo.

Iimpawu eziphambili zokunyuka kwamaxabiso e-Chip yokugcina ngoku

Iinguqu eziphambili: Ngokuphathelele ukunyuka kwamaxabiso, amaxabiso e-DDR5 anyuke ngaphezulu kwe-100% kwinyanga enye; ukunyuka kwexabiso lekhontrakthi ye-Q4 DRAM okulindelweyo kunyuswe ukuya kwi-18%-23%, kunye namaxabiso angengowakho kwezinye iimodeli enyuka ngama-25% kwiveki. Kwizicwangciso zabavelisi, iinkampani eziphambili ezifana ne-Samsung kunye ne-SK Hynix ziye zamisa iikowuteshini zekhontrakthi, zibeka phambili amandla okuvelisa e-HBM (High Bandwidth Memory) kunye ne-DDR5 kwaye zivula kuphela unikezelo kubathengi abakhulu bexesha elide abasebenzisanayo. Umqhubi oyintloko kukunyuka kwemfuno yeeseva ze-AI, ezisebenzisa amandla amaninzi e-wafer, njengoko ababoneleli beenkonzo zelifu bevala amandla kwiminyaka embalwa ezayo kwangaphambili ukuze bakhe iziseko zophuhliso lwamandla ekhompyutha.

Impembelelo yeCandelo leShishini:

Iinkampani ezinkulu zamazwe ngamazwe: iSamsung kunye neSK Hynix zibone ukukhula okukhulu kwingeniso kunye nenzuzo yokusebenza.

Abavelisi basekhaya: Iinkampani ezifana neJiangbolong kunye neBiwin Storage ziphumelele uphuculo olukhulu lokusebenza, nto leyo ekhawulezisa ukutshintshwa kwetekhnoloji.

Imakethi yesiphelo: Ezinye iimpawu ze-elektroniki zabathengi zijongene noxinzelelo lwamaxabiso ngenxa yokunyuka kwamaxabiso okugcina izinto. 

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Izizathu Eziphambili Zokunyuka Kwamaxabiso

Ukunyuka okukhulu kwamaxabiso eetshiphusi zokugcina izinto kunokuqondwa njengebali eliqhelekileyo "lokungalingani kwemfuno yokubonelela", kodwa lixhaswa lutshintsho olukhulu kwezoshishino.

Icala Lokubonelela: Ukuncitshiswa Kwesakhiwo kunye Notshintsho Olucwangcisiweyo

Abavelisi bezixhobo zokuqala ze-storage chip (ii-OEM) ezifana neSamsung, iSK Hynix, kunye neMicron batshintsha ngendlela enobuchule. Batshintsha inani elikhulu le-wafer umthamo ukusuka kwi-DRAM yesiqhelo yabathengi kunye ne-NAND ukuya kwi-HBM ephezulu kunye ne-DDR5 ukuze kuhlangatyezwane neemfuno zeseva ye-AI. Le ndlela "yokuhlutha uPeter ukuba ahlawule uPaul" ikhokelele ngokuthe ngqo ekwehleni okukhulu kwamandla e-storage chips zeenjongo eziqhelekileyo, nto leyo ebangele ukungabikho kwe-spot.

Icala leMfuno: I-AI Wave ibangela iMfuno eNkulu

Imfuno egqithisileyo yeyona nto iphambili. Iinkampani ezinkulu zeenkonzo zelifu zehlabathi (umz., uGoogle, uAmazon, iMeta, iMicrosoft) zityala imali eninzi kwiziseko zophuhliso ze-AI. Iiseva ze-AI zinemfuno ephezulu kakhulu yokugcina i-bandwidth kunye nomthamo, nto leyo enganyusi nje amaxabiso e-HBM kunye ne-DDR5 kodwa ikwathatha amandla oshishino ngokubanzi ngenxa yomthamo wazo omkhulu wokuthenga. Ukongeza, ukwandiswa kwezicelo ze-AI ukusuka kuqeqesho ukuya kwingqiqo kuya kwandisa ngakumbi imfuno ye-DRAM.

Indlela Yokuziphatha Kwemarike: Ukuthenga Ngoloyiko Kuyandisa Ukuguquguquka

Bejongene nolindelo "lokunqongophala kobonelelo," abavelisi beeseva kunye nabavelisi beemveliso ze-elektroniki bamkele ukuthenga ngoloyiko. Endaweni yokuthenga ngekota, bafuna izivumelwano zobonelelo zexesha elide zeminyaka emi-2-3, nto leyo eqinisa ngakumbi iingxabano zexesha elifutshane phakathi kobonelelo kunye nemfuno kwaye yenza ukuguquguquka kwamaxabiso kube nzima ngakumbi.

Impembelelo kwiCandelo leShishini

Oku kunyuka kwamaxabiso kutshintsha ulwakhiwo kunye ne-ecology yecandelo lonke leshishini lokugcina izinto.

IiGiants Zokugcina Izinto Zamazwe Ngamazwe

Njengeenkokheli kwimarike yabathengisi, iinkampani ezifana neSamsung kunye neSK Hynix zifikelele ekukhuleni okuphezulu kwengeniso kunye nenzuzo. Zisebenzisa iingenelo zobuchwepheshe, zigcina amandla aqinileyo amaxabiso kwiimveliso eziphezulu ezifana ne-HBM.

Amashishini Okugcina Izinto Zasekhaya

Olu mjikelo lunika ithuba elibalulekileyo kwimbali kubavelisi basekhaya. Ngokusebenzisa iimpumelelo zobuchwepheshe kunye namaqhinga emarike aguquguqukayo, bafikelele kuphuhliso oluphezulu.

Ukutshintshwa okukhawulezileyo

Phakathi kweenkqubo zokubonelela ngeenkonzo zamazwe ngamazwe eziqinileyo, ii-PCIe SSD zasekhaya kunye nezinye iimveliso zidityaniswa ngokukhawuleza kwiinkqubo zokubonelela ngeenkonzo zamashishini aphambili asekhaya, nto leyo ekhawulezisa kakhulu inkqubo yokutshintshwa kweenkonzo zasekhaya.

Imarike yabathengi beSitishi

Iimveliso ze-elektroniki zabathengi ezinexabiso eliphezulu lokugcina izinto, njengee-smartphones eziphakathi ukuya kwezisezantsi, sele zijongene noxinzelelo lweendleko. Abavelisi beebhrendi bakwingxaki: ukufunxa iindleko ngaphakathi kuya kunciphisa inzuzo, ngelixa ukudlulisela iindleko kubathengi kunokuchaphazela ubungakanani bentengiso.

Imbonakalo yeNdlela yexesha elizayo

Lilonke, eli xesha lobutyebi obukhulu kwimarike yokugcina izinto lisenokuqhubeka ixesha elithile.

Intsingiselo yexabiso

Izibikezelo zezikhungo zibonisa ukuba ukunyuka kwexabiso le-chip yokugcina izinto kunokuthatha ubuncinane ukuya kuthi ga kwi-H1 2026. Ngokukodwa, amaxabiso e-HBM kunye ne-DDR5 kulindeleke ukuba abone ukunyuka okukhulu kwiikota ezimbalwa ezizayo.

Ukuphindaphinda kobuchwepheshe

Ukuhlaziywa kweteknoloji yokugcina izinto kuyanda. Ii-OEM ziya kuqhubeka nokufudukela kwiinkqubo eziphambili (ezifana nee-node ze-1β/1γ), ngelixa iiteknoloji zesizukulwana esilandelayo ezifana ne-HBM4 zibekwe kwi-R&D kunye ne-ajenda yemveliso ngobuninzi ukuze zilandele ukusebenza okuphezulu kunye nenzuzo.

Inkqubo yoKwakha indawo

Eqhutywa ziindlela zobuchwephesha bobuchwephesha kunye nezicwangciso zesizwe, amashishini okugcina izinto aseTshayina aza kuqhubeka nokutyala imali kwi-R&D yetekhnoloji kunye namandla emveliso. Kulindeleke ukuba ngo-2027, amashishini okugcina izinto aseTshayina aza kuphumelela kakhulu kwisabelo semarike yehlabathi kwaye adlale indima ebaluleke ngakumbi kuthotho lwemizi-mveliso yehlabathi.